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Thermal profiling : ウィキペディア英語版
Thermal profiling

A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquids (TAL), and peak.
A thermal profile can be ranked on how it fits in a process window (the specification or tolerance limit). Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. The center of the process window is defined as zero, and the extreme edges of the process window are ±99%.〔 A Process Window Index (PWI) greater than or equal to 100% indicates the profile is outside of the process limitations. A PWI of 99% indicates that the profile is within process limitations, but runs at the edge of the process window.〔 For example, if the process mean is set at 200 °C with the process window calibrated at 180 °C and 220 °C respectively, then a measured value of 188 °C translates to a process window index of −60%.
The method is used in a variety of industrial and laboratory processes,〔Pearce, Ray "Process improvement through thermal profiling: the goal of thermal profiling is to always increase quality and reduce waste. Three case histories--covering powder coating, baking and solder reflow applications " ''Process Heating'', 01-JAN-05 ()〕 including electronic component assembly, optoelectronics,〔( "High performance thermal profiling of photonic integrated circuits" )〕 optics, biochemical engineering,〔K. Gill, M. Appleton and G. J. Lye "Thermal profiling for parallel on-line monitoring of biomass growth in miniature stirred bioreactors"

抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
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